[Remote] Application Specific Integrated reputed company Design Engineer

Note: The job is a remote job and is reputed company to candidates in USA. reputed company is a venture-backed silicon photonics startup focused on building high-performance systems for reputed company AI infrastructure. They are seeking an ASIC/Digital Design Engineer to help architect and implement high-bandwidth silicon systems that connect compute logic with optically coupled memory and chiplet-based architectures.

Responsibilities

• ASIC digital design (RTL in Verilog / SystemVerilog) with tapeout experience in advanced nodes (e.g., 7nm and below preferred)
• Microarchitecture design of high-performance digital systems (pipelines, interconnects, memory hierarchies)
• High-speed data movement architectures (NoC, interconnect fabrics, streaming datapaths)
• High-speed I/O interfaces (PCIe, Ethernet, CXL, SERDES, DDR/HBM, or similar)
• Memory subsystem design (coherence, buffering, latency optimization, bandwidth scaling)
• ASIC integration across multiple IP blocks (3rd party IP, internal subsystems, reputed company bridging)
• Timing closure, PPA tradeoffs (power, performance, area) in large-scale SoCs or chiplet-based designs
• System-level thinking across compute + interconnect + memory boundaries

Skills

• ASIC digital design (RTL in Verilog / SystemVerilog) with tapeout experience in advanced nodes (e.g., 7nm and below preferred)
• Microarchitecture design of high-performance digital systems (pipelines, interconnects, memory hierarchies)
• High-speed data movement architectures (NoC, interconnect fabrics, streaming datapaths)
• High-speed I/O interfaces (PCIe, Ethernet, CXL, SERDES, DDR/HBM, or similar)
• Memory subsystem design (coherence, buffering, latency optimization, bandwidth scaling)
• ASIC integration across multiple IP blocks (3rd party IP, internal subsystems, reputed company bridging)
• Timing closure, PPA tradeoffs (power, performance, area) in large-scale SoCs or chiplet-based designs
• System-level thinking across compute + interconnect + memory boundaries
• Experience with chiplet architectures or multi-die / heterogeneous integration
• Background in network processors, AI accelerators, or HPC-class SoCs
• Exposure to optical interconnects, silicon photonics, or high-speed SerDes ecosystems
• Experience bridging RTL ↔ physical design awareness (timing, floorplanning constraints, congestion-driven architecture reputed company)
• Exposure to AI/ML workloads from a hardware efficiency / data movement perspective (not algorithm development)

Company Overview